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Key Features
14-pin High-Density Layout
14 pins, suitable for multi-channel signal transmission in high-speed optical modules.
High-Speed Signal Optimization
Optimized for high-speed signal transmission; can be used for 25G, 50G optical module packaging.
Customizable Design
Customizable according to the customer's chip structure, pin layout and side-window position.
High-Speed Optical Communication
Suitable for packaging EML, DFB and other high-speed lasers for 25G, 50G optical modules.
Data Center
Can be used for high-speed optical transceiver devices in data-center optical interconnects.
Telecom Network
Suitable for high-speed optical modules in long-distance optical transmission systems of telecommunications.
Pump Lasers
Pump sources for vehicle-mounted LiDAR.
High Pin Density
14-pin design meets the requirements of multi-channel signal transmission and complex circuits.
Mature GTMS Process
Backed by a mature glass-to-metal sealing technology platform, the products have good consistency.
Flexible Customization
Pin layout and side-window position can be flexibly adjusted according to the customer's packaging structure.
The 14-pin side-window butterfly tube shell works by providing a multifunctional platform for mounting, electrical interconnection, optical output and hermetic protection of high-speed laser chips. The base is made of Kovar alloy; the laser chip, lens, etc. are fixed on the mounting surface at the center of the base.
The chip is connected to the 14 pins by wire bonding, achieving low-loss transmission of high-speed signals.
The cover and the tube shell are welded together to form a hermetic cavity; the glass insulator ensures electrical isolation between the pins. Light emitted by the laser chip is output through the optical window on the side wall of the tube shell to the external optical fiber or free space.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar) |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | High-speed optical communication, data center, pump lasers |
