25G TOSA, ROSA ceramic tube shell

Key Features

• HTCC High Temperature Co-fired Ceramic Process:
  Manufactured using high temperature co-fired ceramic process, featuring dense ceramic matrix, high mechanical strength, and excellent thermal stability.

• High-Frequency Signal Transmission Performance:
  

  The tube shell structure is optimized for high-frequency signals, supporting high-speed signal transmission at 25Gbps and above.

• Excellent Hermetic Sealing Performance:

  Hermeticity meets high-reliability standards, effectively protecting internal components.

• Customizable Design Support:

  Tube shell dimensions, optical path structure, pin configuration, and metallization schemes can be customized according to customer requirements to meet personalized application needs..

Applications

• Optical Communications:
  

  Widely used in TOSA and ROSA packaging for 25G optical communications, serving as one of the core packaging components for high-speed optical transceiver modules.

• Data Centers:

  Suitable for optical modules in data center interconnects, supporting high-capacity data transmission.

• Industrial Lasers：

  Applicable to industrial lasers and other industrial application scenarios requiring precision optical packaging.

Product Highlights

• High-Precision Ceramic Forming Technology:
  

  Utilizing advanced HTCC co-firing process, the tube shell achieves high dimensional accuracy to meet precision optical packaging requirements.

• High-Reliability Hermetic Packaging:
  

  Hermeticity reaches ≤1×10⁻⁹ Pa·m³/s, passing rigorous reliability tests including temperature cycling and mechanical shock, suitable for harsh environments.

• Rapid Response Customization Service:

  Equipped with full-process customization capabilities from design and prototyping to mass production, enabling rapid response to customer personalized tube shell development needs.

How It Works

The working principle of the 25G TOSA/ROSA ceramic tube shell is to provide electrical connections for sensitive components such as chips. The ceramic tube shell body is formed using HTCC process, featuring internal optoelectronic component mounting surfaces and fiber alignment structures. Laser chips, TECs, etc. are fixed onto the mounting surfaces inside the tube shell via eutectic soldering or conductive adhesive, with electrical connections between chips and shell pins achieved through gold wire bonding.

Optical fiber is inserted and fixed through the fiber hole in the tube shell, achieving precise optical alignment with the internal chip. The lid is sealed to the tube shell body via solder sealing, forming a hermetic cavity. The high resistivity and low dielectric constant of the ceramic material ensure low-loss transmission of high-frequency signals, while the hermetic sealing structure effectively prevents external moisture and other contaminants from entering, ensuring the stability and reliability of optoelectronic components during long-term operation.

Product Parameters