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Key Features
6-pin Compact Layout
6 pins, compact structure, suitable for packaging medium- and small-power lasers.
Side-Window Optical Output Design
Optical window integrated on the side of the tube shell, convenient for optical signal output and coupling.
Highly Reliable Hermetic Packaging
The GTMS process achieves hermetic sealing, protecting the internal chip for a long time.
Optical Communication Modules
Suitable for packaging DFB, FP and other lasers in optical communication modules.
Sensing & Measurement
Can be used for laser packaging in fiber-optic sensing, optical measurement and other fields.
Pump Laser Sources
Suitable for packaging medium- and small-power fiber laser pump sources.
Compact Structural Design
6-pin compact design, small in size, suitable for miniaturized laser packaging.
Mature GTMS Process
Backed by a mature glass-to-metal sealing technology platform, products have good consistency.
Flexible Customization
Pin layout and side-window position can be flexibly adjusted according to customer packaging requirements.
The 6-pin Side-Window Butterfly Tube Shell works by providing mounting, electrical interconnection, optical output and hermetic protection for medium- and small-power laser chips. The base is made of Kovar alloy; the DFB or FP laser chip is fixed on the mounting surface at the center of the base.
The chip is connected to the glass-insulated pins by wire bonding. A thermistor can be attached near the chip to feedback the junction temperature in real time.
The cover and the tube shell are welded together to form a hermetic cavity; the glass insulator ensures electrical isolation between the pins. Light emitted by the laser chip is output through the optical window on the side wall of the tube shell to the external optical fiber or free space.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar) |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | >5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optical communication modules, pump laser sources |