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High Pin Density Design:
High-density pins are precisely arranged, supporting simultaneous multi-channel signal transmission to meet the interconnection needs of high-integration components.
Excellent Hermetic Sealing Performance:
Hermeticity meets high-reliability standards, effectively protecting internal components from environmental influences.
Good Thermal Dissipation Performance:
The ceramic substrate and pin structure optimize the heat dissipation path, effectively conducting component operating heat to maintain stable operating temperature.
Industrial and Aerospace Electronics:
Suitable for high-reliability, high-integration application scenarios such as industrial control systems and aerospace electronic equipment.
High-Reliability Hermetic Packaging:
Hermeticity reaches ≤1×10⁻⁹ Pa·m³/s, passing reliability tests including temperature cycling, mechanical shock, and salt spray testing, adapting to harsh environments.
One-Stop Customization Service:
Equipped with complete capabilities from wiring design, mold development to mass production, enabling rapid response to customers' customization needs.
The working principle of the 80PIN ceramic package shell is to provide dense electrical interconnection and hermetic protection for high-integration components. The main body of the shell is formed by co-firing multilayer alumina ceramic at high temperatures, with multilayer tungsten metallization wiring patterns printed between ceramic layers.
Chips are fixed within the shell cavity using conductive adhesive or eutectic soldering, and connections between components and the internal ceramic metallization patterns are achieved through wire bonding or flip-chip bonding. The high insulation resistance of the ceramic material ensures electrical isolation between pins, multilayer wiring optimizes signal transmission paths, and the hermetic sealing structure ensures component reliability during long-term operation.
| Parameter | Specification |
|---|---|
| Material | Alumina ceramic (Al₂O₃) |
| Process | HTCC High-Temperature Co-fired Ceramic |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Industrial and aerospace |
