Butterfly shaped 8-pin tube shell

Key Features

• Metal Housing Hermetic Packaging:
  

  Uses a Kovar alloy base for reliable hermeticity and long-term protection of internal chips.

• Glass-to-Metal Sealing Technology (GTMS)：

  Pins are sealed to the base via glass insulator sintering, providing excellent electrical isolation and hermeticity.

• Customizable Design:

  Customizable based on customer chip dimensions, pin layout, and optical interface.
  

Applications

• Optical Communication:
  

  Used for butterfly packaging of DFB, FBG and other lasers and high-speed optical modules.

• Pump Lasers:

  
  

  Suitable for laser pump sources.

• Light-Emitting Diodes:

  Used for SLD/SLED super-luminescent diode light sources in fiber-optic gyroscopes.
  

Product Highlights

• Mature Packaging Platform

  Backed by mature GTMS technology, the product offers good consistency and is suitable for mass production.

• Excellent Hermetic Reliability

  Hermeticity meets high-reliability standards; passes temperature cycling, mechanical shock and other reliability tests.

• Fast Response to Customization

  Capable of full-process service from structural design and sample fabrication to mass production.

How It Works

The Butterfly 8-pin tube shell works by providing a mounting platform, electrical interconnection, and hermetic protection environment for the laser chip. The base is made of Kovar alloy, with the chip-mounting area located at the center of the base; the laser chip is fixed on the mounting surface.

The chip is connected to the glass-insulated pins through wire bonding, achieving electrical interconnection between the chip and the external driving circuit.

The cover and the tube shell are sealed by welding to form a hermetic cavity. The glass insulator achieves electrical isolation and hermetic sealing between the pins and the base. Light emitted by the laser chip is output through the optical window of the tube shell or via a fiber-coupling interface.

Product Parameters