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Efficient Heat Dissipation Design:
The base uses high thermal conductivity materials with optimized heat dissipation structure, effectively conducting heat generated by high-power laser chips.
Excellent Mechanical Protection Performance:
The metal housing structure is robust with excellent vibration and shock resistance, suitable for various harsh application environments.
Customizable Design Support:
Customized production can be provided based on customer chip specifications, power levels, optical interfaces, and pin schemes.
Fiber Laser Pump Sources:
Applicable to fiber lasers and fiber amplifiers.
Industrial Welding and Cutting:
Suitable for precision welding and cutting processing in industrial manufacturing, meeting high-efficiency, high-reliability production requirements.
Scientific Research and Defense:
Suitable for application scenarios requiring high-power, high-reliability laser sources such as scientific experiments and defense equipment.
High-Reliability Hermetic Packaging:
Hermeticity reaches ≤1×10⁻⁹ Pa·m³/s, passing rigorous reliability tests including temperature cycling and mechanical shock.
Flexible Customization Solutions:
Tube shell designs can be quickly adjusted based on customer component specifications, providing full-process services from prototyping to mass production.
The working principle of the high-power laser package casing is to provide a comprehensive solution for electrical interconnection and hermetic protection of high-power laser chips. The casing base is manufactured using high thermal conductivity materials, and chips are fixed on the base heat dissipation surface through eutectic soldering or similar methods. The base efficiently conducts heat generated by the chip to external heat sinks or TECs, maintaining the chip at an appropriate operating temperature.
Chips achieve electrical connection with casing pins through wire bonding, and drive current is input through the pins to excite the laser. Optical windows or fiber coupling components are installed on the casing's optical interface, precisely outputting the laser beam emitted by the chip. The hermetic sealing structure effectively prevents external moisture, dust, and other contaminants from entering, ensuring the stability and lifetime of the laser chip during long-term high-power operation.
| Parameter | Specification |
|---|---|
| Material | Kovar, Tungsten-Copper alloy (CuW) |
| Structure Design | BOX Cavity |
| Thermal Stability | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Fiber laser pump sources, industrial welding and cutting, scientific research and defense |
