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Key Features
Excellent Thermal Stability
Alumina ceramic has a stable thermal expansion coefficient.
Customizable Design
Customizable according to the customer's wiring design and outline dimensions.
Optical Communication Modules
Suitable for the mounting and packaging of optical communication lasers, detectors and other optoelectronic devices.
Microwave & RF
Suitable for the packaging substrate of microwave and RF devices.
Good Thermal Matching
The thermal expansion coefficient of alumina ceramic matches the silicon chip, reducing thermal stress.
Flexible Customization
Possesses complete customization capabilities from wiring design to mass production.
The White Ceramic LED-2PIN Bracket-φ3 works by providing a multifunctional platform for electrical interconnection, heat dissipation and mechanical support for optoelectronic devices. The chip is mounted on the surface of the bracket by solder or conductive adhesive, and is connected to the internal wiring of the bracket by wire bonding.
The high thermal conductivity of the ceramic substrate can effectively conduct the heat generated by the device, and the high insulation resistance ensures the electrical isolation between circuits, making the bracket an ideal platform for high-power and high-density circuits.
| Parameter | Specification |
|---|---|
| Material | Alumina ceramic (Al₂O₃) |
| Process | Ceramic-Glass-Metal |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optical communication modules, microwave & RF |
