China High-power laser diode package

Key Features

• Superior Thermal Management:
  Manufactured from high-performance thermal management materials — Kovar alloy and CuW — with a coefficient of thermal expansion matched to the chip.

• Reliable Hermetic Sealing:
  

  Glass-to-metal sealing process achieves high hermeticity standards, effectively protecting sensitive internal chips.

• Excellent Mechanical Strength:
  Hermetic package housing exhibits superior mechanical strength and vibration/shock resistance, suitable for industrial and mil-grade application environments.

• Customizable Design：

  Package can be customized based on chip dimensions, power level, wavelength, and package form factor of different laser diode chips.
  

Applications

• Industrial Laser Processing Equipment:
  

  Widely used as high-power laser sources in industrial equipment such as laser cutting, laser welding, and laser marking machines.

• Medical Laser Equipment:
  

  Suitable for various medical laser therapy devices.

• Laser Pump Applications:
  Widely used in pump sources of solid-state lasers and fiber lasers.

• Defense & Scientific Research:
  Plays an important role in defense and research applications such as LiDAR, laser guidance, and spectroscopic instruments.

Product Highlights

• High Power Density Operation:
  

  Optimized for high-power applications, effectively handling high thermal loads during laser diode operation and supporting multiple power levels.

• Long-Term Operational Stability:
  

  Stringent material selection and manufacturing process control ensure long-term stability and reliability under high-power, high-temperature operating conditions.

How It Works

material; the laser chip is bonded to the heat-dissipation surface of the base using thermally conductive adhesive or eutectic solder, ensuring effective heat transfer to an external heatsink.

Electrical connections are established via wire bonding, connecting the chip to the package pins. For lasers requiring precise temperature control, a thermistor (NTC) and thermoelectric cooler (TEC) can be integrated inside the package to achieve accurate temperature regulation. The lid is hermetically sealed to the base by soldering, forming a hermetic protective environment that prevents external environmental factors from affecting the performance and lifespan of the internal laser chip.

Product Parameters