Customizable TEC oxygen free copper packaging shell

Key Features

• High-Conductivity OFC Material:
  

  Manufactured from high-purity oxygen-free copper (OFC) with extremely high thermal conductivity, significantly improving TEC operating efficiency and temperature control uniformity.

• Excellent Temperature Uniformity:
  

  The high thermal conductivity of OFC ensures temperature uniformity on the TEC cold/hot surface, improving stability and precision of the component operating temperature.

• Reliable Hermetic Sealing:

  High-reliability hermetic sealing process effectively protects internal TEC, thermistor, and optoelectronic components from environmental factors.

• Deep Customization Support:

  Supports in-depth customization based on specific customer requirements, including TEC configuration, cavity structure, optical interface, and cooling solutions.
  

Applications

• High-Power Lasers:
  

  In high-power lasers requiring precise temperature control, the OFC TEC housing provides excellent temperature control performance and thermal management capability.

• High-End Scientific Research:

  In various high-end scientific research projects, the customizable TEC OFC housing provides flexible and high-performance packaging solutions for novel optoelectronic components.

Product Highlights

• Extremely High Thermal Conductivity:
  

  The thermal conductivity of OFC is far higher than conventional packaging materials, significantly improving TEC operating efficiency and temperature control precision.

• Excellent Temperature Uniformity:
  

  High-conductivity OFC ensures temperature control uniformity, reducing temperature gradients and improving component operating performance and stability.

• Deep Customization Capability:

  Supports comprehensive customization from materials and structure to interfaces, meeting the requirements of various high-end and specialized applications.

How It Works

The customizable TEC OFC package housing utilizes the high thermal conductivity of OFC to optimize the operating efficiency and temperature control performance of the TEC (thermoelectric cooler). The optoelectronic component is mounted on the cold side of the TEC inside the housing cavity; the hot side of the TEC is connected to the housing base through the OFC material.

Due to the extremely high thermal conductivity of OFC, heat generated at the TEC hot side is quickly and uniformly conducted to the housing base and then dissipated through the connection to an external heatsink. This significantly improves the TEC operating efficiency and temperature control capability. OFC also possesses excellent electromagnetic shielding properties, providing good electromagnetic environmental protection for sensitive optoelectronic components.

Product Parameters