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Customized Cavity Structure:
Cavity structure design can be customized based on the chip layout, pin configuration, and cooling requirements of the power module.
Excellent Thermal Management Capability:
Manufactured from high-thermal-conductivity materials to effectively dissipate the substantial heat generated during power module operation.
High Electrical Insulation:
Cavity structure design and material selection fully consider electrical insulation performance requirements, effectively preventing electrical breakdown and leakage.
Photodetectors:
Provides a stable and reliable hermetic packaging environment for photodetectors; widely used in optical communication modules.
Laser Diodes & Fiber-Optic Components:
Suitable for hermetic packaging and protection of various laser diodes and fiber-optic assemblies.
High Power Handling Capability:
Designed for high-power applications, supporting the packaging requirements of high-current power modules.
Excellent System Reliability:
Premium material selection and stringent manufacturing processes ensure reliability and stability of power modules under long-term high-load operating conditions.
Flexible Customization Capability:
Customizable design based on the individual requirements of different power modules to meet various specialized application needs.
The power module housing cavity package provides mechanical support, electrical insulation, thermal conduction paths, and environmental protection for power semiconductor chips.
Connections are established via wire bonding or terminal connections, connecting chip electrodes to module pins or terminals. The cavity structure design of the housing must fully consider safety requirements such as electrical clearance and creepage distance to prevent electrical breakdown and leakage. For high-power modules, cooling channels can also be designed into the housing to enable forced cooling. The lid is connected to the base through a sealing gasket to protect the internal power chips from environmental factors.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Photodetectors, laser diodes & fiber-optic components |
