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High-Reliability Hermetic Sealing:
Hermeticity meets high-reliability standards, effectively protecting laser chips from moisture and contaminants.
Excellent Mechanical Protection Performance:
The metal casing structure is robust, with excellent vibration and shock resistance, adapting to various harsh industrial and military environments.
Customizable Design Support:
Customized production can be provided based on customer chip specifications, power levels, optical interfaces, and pin schemes.
Industrial Laser Processing:
Suitable for high-power laser packaging in industrial processing scenarios such as laser cutting, laser welding, and laser marking.
Fiber Laser Pump Sources:
Can be used for pump laser diode packaging in fiber lasers and fiber amplifiers.
Medical and Scientific Research Lasers:
Suitable for high-power laser source packaging in medical laser equipment and scientific research laser systems.
Defense and Aerospace:
Suitable for application scenarios requiring high-reliability, high-power laser sources in defense equipment and aerospace systems.
High-Reliability Hermetic Packaging:
Hermeticity reaches ≤1×10⁻⁹ Pa·m³/s, passing rigorous reliability tests including temperature cycling and mechanical shock.
Flexible Customization Solutions:
Tube shell designs can be quickly adjusted based on customer component specifications, providing full-process services from prototyping to mass production.
The working principle of the DWG01 high-power laser casing is to provide a comprehensive solution for thermal dissipation, electrical interconnection, optical output, and hermetic protection of high-power laser chips. The casing base is manufactured using Kovar alloy material, and the laser chip is fixed on the base heat dissipation surface through eutectic soldering. The base efficiently conducts heat generated by the chip to external heat sinks or TECs, maintaining the chip at an appropriate operating temperature.
The chip achieves electrical connection with the casing pins through wire bonding, and drive current is input through the pins to excite the laser. The hermetic sealing structure effectively prevents external moisture, dust, and other contaminants from entering, ensuring the stability and lifetime of the laser chip during long-term high-power operation.
| Parameter | Specification |
|---|---|
| Material | Kovar, Tungsten-Copper alloy (CuW) |
| Structure Design | BOX Cavity |
| Thermal Stability | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Industrial lasers, fiber laser pump, medical and scientific research, defense and aerospace |
