Dual-laser diode package

Key Features

• Dual-Chip Integration:
  Integrates two laser diode chips within a single package, significantly reducing system footprint and cost compared to two independent packages.

• High-Reliability Design:
  

  Manufactured from high-reliability materials and processes, with rigorous quality inspection and reliability testing to ensure long-term stable operation.

• Compact Structure:
  Dual-chip integration results in a more compact package structure, contributing to overall system miniaturization and weight reduction.

Applications

• Industrial Manufacturing:
  

  Used in precision manufacturing processes such as material processing, welding, and cutting; particularly suitable for dissimilar-material processing and high-precision micromachining.

• Optical Communications & Sensing:
  

  Used in wavelength-division multiplexing (WDM) communications, fiber-optic sensing, multi-parameter detection, and industrial monitoring systems.

• Medical Laser Equipment:
  Provides a compact and efficient multi-wavelength solution for medical laser devices requiring multi-wavelength therapy.

Product Highlights

• System Space & Cost Savings:
  

  
  

  Integrating two laser diodes into a single package significantly reduces PCB footprint and system cost while improving system integration density.

• Flexible Customization Capability:
  

  Supports customized design based on customer requirements, including chip selection, optical path configuration, and pin definition.

• Superior Thermal Management:
  Each chip has an independent thermal management path, combined with optimized heat-conduction design, ensuring effective thermal dissipation under dual-chip operating conditions.

How It Works

The dual laser diode package integrates two independent laser diode chips within a single enclosure, each with its own electrical connections, thermal management path, and optical output interface. The two chips can be independently controlled or operated in coordination, depending on application requirements.

In redundancy mode, the system ensures continuous uninterrupted operation. In power-combining mode, the outputs of both chips are combined using a beam-combining component to achieve higher output power. The optical path design inside the hermetic package requires precise control of the output beam path of each chip to ensure the quality and stability of the final output spot.

Product Parameters