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All-Metal Hermetic Package Structure:
The product adopts a metal cavity design; hermetic sealing achieves complete isolation of the internal space from the external environment, effectively preventing moisture, contaminants, and corrosive media from entering the package.
BOX-Type Functional Cavity Design:
Regular BOX cavity structure provides standardized installation space for filter chips, facilitating optimized component layout and integrated design of multiple structural configurations.
High-Reliability Material & Structural System:
Utilizes material systems such as Kovar and CuW to meet varying CTE matching and thermal conductivity requirements, ensuring structural stability of the device under thermal cycling and complex operating conditions.
Filter Packaging:
Used for filter module packaging in communication systems; when packaged with filter components, enables signal selection, interference suppression, and frequency shaping functions.
High-Reliability Electronic Systems:
Used in industrial-grade and high-stability electronic equipment, meeting reliability requirements for long-term operation in complex environments.
Precision Electronic Packaging
Suitable for high-density, miniaturized electronic module packaging applications, supporting various customized integration solutions.
High Shielding & Low Interference Performance:
The metal structure provides excellent electromagnetic shielding capability, effectively reducing the impact of external interference on filter performance.
High Hermetic Reliability:
Hermetic sealing process achieves long-term stable hermeticity, suitable for harsh environment applications.
Strong Flexible Customization Capability:
Supports multi-dimensional customization of cavity structure, pin layout, and material system to accommodate different filter design solutions.
This product provides a stable, protective operating environment for internal components through the metal cavity structure, utilizing glass-to-metal hermetic sealing to achieve hermetic packaging of electrical leads, enabling input/output signals to complete transmission and filtering processing in a sealed environment.
External signals enter the internal filter structure through the pins for frequency selection or signal processing, then output through pins on the other side, achieving stable electrical signal transmission while the cavity structure provides shielding and mechanical protection.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | >5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Filter packaging, high-reliability electronic systems, precision electronic packaging |