HTCC ceramic plate

Key Features

• Multilayer High-Density Wiring:
  The HTCC process enables multilayer ceramic co-firing, with interlayer interconnection through metallized vias, offering high wiring density to meet complex circuit design requirements.

• Excellent Thermal Stability:
  

  Alumina ceramic offers stable performance at high temperatures, with a thermal expansion coefficient matching silicon chips, suitable for high-power component mounting.

• High Mechanical Strength:

  The high-temperature co-fired ceramic substrate is dense and strong, with excellent flexural strength, capable of withstanding mechanical stresses from subsequent assembly processes.

Applications

• Optical Communications and Optoelectronic Modules:
  

  Suitable for optoelectronic component substrates and optical module circuit substrates, providing high-density interconnection and thermal dissipation platforms.

• Industrial Electronics:

  Can be used as thermal dissipation substrates for high-power components such as power modules, supporting high-reliability operation.

• Industrial and Aerospace:

  Suitable for high-reliability, high-stability application scenarios such as industrial control and aerospace electronics.

Product Highlights

• Mature HTCC Co-firing Technology:
  

  Utilizing mature HTCC high-temperature co-firing process, the substrate offers high density, strong interlayer bonding, and good dimensional stability

• Excellent Thermal Dissipation and Thermal Matching:

  Alumina ceramic offers high thermal conductivity, with a thermal expansion coefficient matching chips, reducing thermal stress and improving component reliability.

• Full-Process Customization Service:

  Equipped with complete capabilities from wiring design, green tape processing, co-firing to post-metallization treatment, providing one-stop customization.

How It Works

The working principle of the HTCC ceramic substrate is to provide a multifunctional platform for electrical interconnection, thermal dissipation, and mechanical support for electronic components. The substrate is composed of stacked multilayer alumina ceramic green tapes, with metallization patterns printed on each green tape layer, and interlayer electrical interconnection achieved through vias filled with metallization paste.

The stacked green body is co-fired at high temperatures, with ceramic densification and metallization sintering completed simultaneously, forming an integrated multilayer ceramic substrate. Chips are mounted on the metallization pads on the substrate surface using solder or conductive adhesive, and connections to the internal substrate wiring are achieved through wire bonding. The high thermal conductivity of the ceramic substrate effectively conducts component heat, and the high insulation resistance ensures electrical isolation between circuits, making the substrate an ideal carrier platform for high-power, high-density circuits.

Product Parameters