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High-Hermeticity Design:
High-reliability hermetic sealing process achieves high hermeticity standards, effectively isolating the internal environment from the outside.
Integrated TEC Temperature Control:
Integrated thermoelectric cooler (TEC) inside the housing achieves precise control of the component operating temperature.
Excellent Thermal Management Performance:
The housing base is manufactured from high-thermal-conductivity material, effectively conducting and dissipating heat generated during TEC operation to ensure efficient TEC performance.
Customization Support:
Customizable design based on different component types and application requirements.
High-Precision Lasers:
In high-precision lasers requiring wavelength stability and output power stability, the TEC housing achieves precise temperature control to ensure stable performance.
Photodetectors:
For temperature-sensitive photodetectors, the TEC housing provides a stable working temperature environment.
Precise Temperature Control Capability:
Integrated high-performance TEC and thermistor enable high-precision temperature control to meet demanding application requirements.
High-Hermeticity Assurance:
Reliable sealing process and premium materials ensure high hermeticity and long-term reliability of the package.
Superior Thermal Management Design:
The base uses high-thermal-conductivity material combined with optimized heat-conduction path design to ensure efficient TEC operation and temperature uniformity of the component.
The high-hermeticity TEC housing precisely controls the operating temperature of the optoelectronic component via a thermoelectric cooler (TEC) integrated inside the package.
The optoelectronic component is mounted on the cold side of the TEC; by controlling the direction and magnitude of the TEC current, the component operating temperature can be precisely regulated. A thermistor mounted in close proximity to the component continuously monitors the component temperature and feeds it back to the temperature control circuit, forming a closed-loop temperature control system. The high-hermeticity housing design protects the internal TEC, thermistor, and optoelectronic component from external environmental factors, ensuring long-term stable operation of the temperature control system.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | >5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Laser diodes, photodetectors |