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High air tightness TEC housing

The high-hermeticity TEC (thermoelectric cooler) housing is a professional packaging solution designed for optoelectronic components requiring precise temperature control. Integrating a thermoelectric cooler (TEC), it achieves precise regulation of the component operating temperature while providing high-hermeticity sealing to effectively protect sensitive internal components.

Widely used in packaging of temperature-sensitive, high-precision optoelectronic components such as laser diodes and photodetectors.
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Key Features

  • High-Hermeticity Design:
    High-reliability hermetic sealing process achieves high hermeticity standards, effectively isolating the internal environment from the outside.

  • Integrated TEC Temperature Control:

    Integrated thermoelectric cooler (TEC) inside the housing achieves precise control of the component operating temperature.

  • Excellent Thermal Management Performance:
    The housing base is manufactured from high-thermal-conductivity material, effectively conducting and dissipating heat generated during TEC operation to ensure efficient TEC performance.

  • Customization Support:

    Customizable design based on different component types and application requirements.

Applications

  • High-Precision Lasers:

    In high-precision lasers requiring wavelength stability and output power stability, the TEC housing achieves precise temperature control to ensure stable performance.

  • Photodetectors:

    For temperature-sensitive photodetectors, the TEC housing provides a stable working temperature environment.

Product Highlights

  • Precise Temperature Control Capability:

    Integrated high-performance TEC and thermistor enable high-precision temperature control to meet demanding application requirements.

  • High-Hermeticity Assurance:

    Reliable sealing process and premium materials ensure high hermeticity and long-term reliability of the package.

  • Superior Thermal Management Design:

    The base uses high-thermal-conductivity material combined with optimized heat-conduction path design to ensure efficient TEC operation and temperature uniformity of the component.

How It Works

The high-hermeticity TEC housing precisely controls the operating temperature of the optoelectronic component via a thermoelectric cooler (TEC) integrated inside the package.


The optoelectronic component is mounted on the cold side of the TEC; by controlling the direction and magnitude of the TEC current, the component operating temperature can be precisely regulated. A thermistor mounted in close proximity to the component continuously monitors the component temperature and feeds it back to the temperature control circuit, forming a closed-loop temperature control system. The high-hermeticity housing design protects the internal TEC, thermistor, and optoelectronic component from external environmental factors, ensuring long-term stable operation of the temperature control system.

Product Parameters

ParameterSpecification
MaterialKovar alloy, Copper-Tungsten alloy (CuW)
Structural DesignBOX cavity
Temperature ResistanceHigh thermal stability
Hermeticity≤1×10⁻⁹ Pa·m³/s
Electrical Insulation>5000 MΩ @ DC 100 V
Surface FinishNickel plating, Gold plating
DimensionsCustomizable design
PackagingStandard packaging
ApplicationsLaser diodes, photodetectors





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Xuri is committed to the solution of glass and metal sealing products, from material assembly, high temperature sintering, surface treatment (electrochemical plating), part welding to product testing, completely independent production.

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  No.388,Dalian Road,Rizhao Economic and Technological Development Zone,Shandong Province,China

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