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High-frequency 8-channel optical device housing

The High-Frequency 8-Channel Optical Device Housing is a high-density butterfly-packaged tube shell designed for multi-channel high-frequency optoelectronic devices. The product adopts a Kovar alloy base structure and is configured with 8 independent signal channels, which can simultaneously support the input/output of multi-channel optical signals. The pins use the GTMS process to achieve hermetic sealing and electrical isolation, suitable for high-frequency and high-speed optical communication modules.

The product supports customized design according to the customer's chip layout, number of channels and signal interface, and can integrate TEC, thermistor and other temperature-control components to meet the packaging requirements of multi-channel parallel optical modules.
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Key Features

  • 8-Channel Parallel Design

    Supports 8 independent signal channels, meeting the packaging needs of multi-channel parallel optical modules.

  • High-Density Pin Layout

    High-density pin layout, suitable for complex multi-channel circuit design.

  • Customizable Design

    Customizable according to the customer's chip layout, number of channels and signal interface.

Applications

  • Multi-Channel Optical Communication

    Suitable for multi-channel optical modules and other multi-wavelength modules.

  • Data Center

    Can be used for high-speed multi-channel optical interconnect modules in data centers.

Product Highlights

  • Multi-Channel Integration Advantage

    Integrated 8-channel design reduces module size and improves system integration.

  • Flexible Customization

    Number of channels and pin layout can be flexibly adjusted according to customer needs.

How It Works

The High-Frequency 8-Channel Optical Device Tube Shell works by providing a high-frequency, low-loss signal-transmission and hermetic-protection environment for multi-channel optoelectronic devices. The base is made of Kovar alloy, and multiple independent chip-mounting areas are arranged inside, which are used for the mounting of multi-channel laser or detector chips respectively. The chips are fixed on the metallized mounting surface and connected to the corresponding pins through wire bonding.

TEC can be fixed at the bottom of the base with solder to achieve precise temperature control together with the external temperature-control circuit.


The cover and the tube shell are welded together to form a hermetic cavity, protecting the internal chips from environmental influences. Multi-channel optical signals are output through the multiple optical interfaces on the tube shell.

Product Parameters

ParameterSpecification
MaterialKovar alloy (Kovar)
ProcessGTMS
Temperature ratingHigh thermal stability
Hermeticity≤1×10⁻⁹ Pa·m³/s
Electrical insulation>5000 MΩ at DC 100 V
Surface FinishNickel/gold plating
DimensionsCustomizable design
PackagingStandard packaging
ApplicationsMulti-channel optical communication, data center






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Xuri is committed to the solution of glass and metal sealing products, from material assembly, high temperature sintering, surface treatment (electrochemical plating), part welding to product testing, completely independent production.

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  +86-633-3698398
  No.388,Dalian Road,Rizhao Economic and Technological Development Zone,Shandong Province,China

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