High power laser casing (partially gold-plated)

Key Features

• Selective Gold Plating:
  Selective gold plating on critical soldering and electrical contact areas with controlled plating thickness effectively improves soldering quality and long-term reliability while optimizing cost.

• Excellent Thermal Dissipation:
  

  Manufactured from high-thermal-conductivity materials such as CuW, effectively conducting and dissipating substantial heat generated during operation.

• Hermetic Package Structure:
  AuSn eutectic solder hermetic sealing process achieves high hermeticity standards, effectively protecting internal chips.

Applications

• Industrial Laser Processing:
  

  Widely used as high-power laser sources in industrial equipment such as laser cutting machines and laser welding machines.

• Medical Laser Equipment:
  

  Suitable for various medical laser applications requiring high precision and reliability.

• Laser Pump Sources:
  Widely used in pump sources of solid-state lasers, providing high-power, high-stability pump light output.

Product Highlights

• Cost-Optimized Selective Gold Plating:
  

  Selective gold plating effectively controls product cost while ensuring soldering performance and corrosion resistance, achieving an optimal balance between performance and cost

• Superior Thermal Management:
  

  High-performance thermal management materials such as CuW, combined with optimized heat-conduction path design, ensure effective thermal dissipation under high-power operating conditions.

• High-Reliability Assurance:
  Rigorous quality inspection and reliability testing ensure long-term stable operation.

• Comprehensive Customization Capability:
  Full capabilities from design to production, enabling tailor-made product solutions to meet customer requirements.

How It Works

The high-power laser casing (partially gold-plated) provides mechanical support, thermal conduction paths, electrical connection interfaces, and environmental protection for high-power laser diode chips. The chip is bonded to the heat-dissipation surface of the casing base using AuSn eutectic solder or conductive silver epoxy, ensuring effective heat transfer to the base.

Electrical connections are established via wire bonding or flip-chip bonding, connecting the chip anode and cathode to the package pins. The lid is hermetically sealed to the base using AuSn solder, forming a hermetic protective environment that ensures long-term stable operation of the laser chip.

Product Parameters