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High-current feedthrough capability:
The multi-pin structure supports high operating-current feedthroughs to meet the demands of high-power lasers.
Reliable hermetic packaging：
Hermeticity of ≤1×10⁻⁹ Pa·m³/s protects the laser chip.
Customized pin layouts:
Pin count and layout can be customized to customer requirements.
High-power lasers:
Used for packaging high-power laser diode chips.
Laser pump sources:
Suitable for fiber laser pump modules.
Industrial processing:
Used in laser welding, cutting and other industrial laser equipment.
High power-handling capability:
The multi-pin and metal base design supports high currents and high power.
Full-process quality assurance:
In-house production and inspection from materials to finished products.
A high-power laser diode generates substantial heat during operation and requires a high drive current. The housing provides high-current feedthrough paths through its multi-pin structure, and the pins are connected to the internal chip by wire bonding. The laser chip is die-attached to the heat sink of the base, and the heat is conducted through the metal base to the external heat dissipation system. The glass insulators electrically isolate the pins from the metal base while achieving a hermetic seal, ensuring stable and reliable laser operation under high-temperature, high-current conditions.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, CuW (tungsten-copper) alloy |
| Structure | BOX cavity |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | High-power lasers, laser pump sources, industrial processing |
