High-power, multi-wavelength base assembly casing.

Key Features

• Multi-Wavelength Integrated Packaging:
  

  The base supports integrated mounting of multiple laser chips with different wavelengths, achieving multi-wavelength coupling output through optical beam combining, enhancing system integration.

• Efficient Heat Spreading Design:
  

  The base optimizes heat dissipation paths for multi-chip layout, providing excellent heat spreading performance.

• Customizable Design Support:

  Customized production can be provided based on customer multi-wavelength scheme, chip layout, beam combining design, and pin configuration.

Applications

• Fiber Lasers and Amplifiers:
  

  Suitable for system packaging requiring multi-wavelength laser integration, such as multi-wavelength pumped fiber lasers and fiber amplifiers.

• Industrial Laser Processing:
  

  
  

  Can be used in multi-wavelength laser processing systems, meeting wavelength requirements for processing different materials

• Medical and Scientific Research:
  

  
  

  Suitable for applications requiring multi-wavelength laser sources, such as multi-wavelength medical laser equipment and scientific research experiment systems.

  
  

• Defense and Aerospace:

  Suitable for application scenarios requiring high-reliability multi-wavelength laser integration in defense equipment and aerospace systems.

Product Highlights

• Multi-Wavelength Integrated Packaging Technology:
  

  Possesses capabilities in precision layout of multi-wavelength laser chips and optical beam combining design, achieving highly integrated multi-wavelength packaging.

• High-Reliability Hermetic Packaging:

  Hermeticity reaches ≤1×10⁻⁹ Pa·m³/s, passing rigorous reliability tests including temperature cycling and mechanical shock.

• Flexible Customization Solutions:

  Tube shell designs can be quickly adjusted based on customer component specifications, providing full-process services from prototyping to mass production.

How It Works

The working principle of the high-power multi-wavelength base assembly casing is to provide an integrated thermal dissipation, electrical interconnection, and hermetic protection platform for multiple laser chips with different wavelengths. The base is manufactured using high thermal conductivity materials, with multiple laser chip mounting positions on the surface. Optimized heat dissipation channels between mounting positions achieve thermal uniformity, ensuring uniform temperature during multi-chip operation.

Laser chips with different wavelengths are respectively fixed on each mounting position of the base through eutectic soldering or similar methods, and electrical connections with respective pins are achieved through wire bonding. Laser beams of different wavelengths emitted by each chip are coupled through the optical beam combining structure integrated on the base, achieving multi-wavelength beam combining output. The hermetic sealing structure effectively protects multi-wavelength laser chips, ensuring system stability and reliability during long-term high-power operation.

Product Parameters