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Optical Path Protection Design:
Housing structure design fully considers the optical path protection requirements of laser sensors, effectively preventing the influence of dust and moisture on the optical path to maintain sensing accuracy.
High-Quality Material Construction:
Manufactured from Kovar alloy and CuW, featuring excellent mechanical strength, thermal stability, and chemical stability.
Reliable Hermetic Sealing:
High-reliability hermetic sealing process effectively protects internal chips from environmental factors.
LiDAR (Light Detection and Ranging):
Provides reliable packaging for LiDAR sensors in applications such as autonomous driving, ADAS, robot navigation, and terrain mapping.
Laser Ranging & Displacement Sensing:
Provides stable and reliable packaging protection for laser rangefinders and displacement sensors in precision measurement, industrial automation, and construction applications.
Scientific Research & Aerospace Sensing:
Meets the extremely high reliability and environmental adaptability requirements for package housings in extreme environments for various scientific research projects and aerospace applications.
Harsh Environment Adaptability:
The product features excellent wide-temperature-range operation, vibration and shock resistance, and weathering resistance, suitable for various harsh application environments.
Flexible Customization Services:
Customizable design based on the individual requirements of different laser sensors, including optical interfaces, dimensions, pins, and materials.
The laser sensing housing provides a stable, protective operating environment for laser sensors, including both laser transmitters and photodetectors. The laser transmitter is mounted at the transmit optical path position of the housing; the emitted laser beam exits through an optical window and illuminates the target object.
The reflected laser signal is focused onto the photodetector through the receiving optical system of the housing to achieve laser signal detection and processing. The housing must ensure precise alignment and long-term stability of both the transmit and receive optical paths while protecting these sensitive optoelectronic components from environmental factors such as dust and moisture.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | LiDAR, scientific research & aerospace sensing, laser ranging & displacement sensing |
