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Ultra-high thermal conductivity:
Oxygen-free copper offers a thermal conductivity of about 390 W/m·K for highly efficient heat dissipation.
Oxygen-free copper material：
High purity with excellent electrical and thermal conductivity.
Nickel/gold plating options:
Flexible surface treatments to meet soldering and corrosion-resistance requirements.
High-power lasers:
Used for packaging high-power laser diode chips.
High-power LEDs:
Suitable for high-power LED light source packaging.
Power modules:
Used for thermal management packaging of power electronic modules.
Efficient heat dissipation:
Rapidly removes heat, lowering the junction temperature and extending service life.
High reliability:
Excellent thermal conductivity and structural strength for harsh operating conditions.
Flexible customization:
Casing structures can be customized to device dimensions.
High-power devices generate a large amount of heat during operation; if the heat is not removed promptly, the chip junction temperature rises and performance degrades. Leveraging the high thermal conductivity of copper, the oxygen-free copper casing rapidly conducts the heat generated by the chip through the base to the external heat sink, forming an efficient heat dissipation path. Meanwhile, the metal casing provides hermetic protection and electromagnetic shielding for the internal elements, and the pins achieve electrical feedthrough through glass insulators, ensuring stable device operation under high-temperature conditions.
| Parameter | Specification |
|---|---|
| Material | Oxygen-free copper |
| Structure | BOX cavity |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | High-power lasers, high-power LEDs, power modules |
