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High power handling:
Supports the packaging of high-power laser chips to meet high-power requirements.
Optical integration capability:
Supports integrated packaging of laser chips and optical elements.
Reliable hermetic protection:
Hermetic packaging extends the service life of the laser light source.
Laser projection display:
Used for RGB light source packaging in laser projectors.
Laser illumination:
Suitable for laser illumination light source modules.
Specialty display:
Used in cinemas, engineering projection and other high-end display applications.
Stable and reliable:
Hermeticity of ≤1×10⁻⁹ Pa·m³/s; the package ensures long-term stability.
Customization services:
Tube shell structures tailored to projection optics requirements.
Laser projection display requires light sources with high brightness and high color purity. The tube shell hermetically seals the laser chip inside and dissipates heat through the metal base, keeping the chip temperature under control during high-power output. The window or optical path structure of the shell directs the laser output along the designed direction, working with the external optical system to form the projected image. The hermetic environment protects the chip from moisture and oxidation, ensuring long-term stability of color purity and output power.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, CuW (tungsten-copper) alloy |
| Structure | BOX cavity |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | >5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Laser projection, laser illumination |