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HTCC Multilayer Co-fired Structure:
Utilizing multilayer alumina ceramic and tungsten metallization co-firing process, with tightly bonded interlayers, high structural strength, and excellent electrical insulation performance.
Excellent Thermal Management Performance:
The ceramic substrate has good thermal conductivity, effectively dissipating component operating heat and enabling temperature control.
High-Reliability Hermetic Sealing:
Hermeticity meets high-reliability standards, providing long-term protection for stable internal component performance.
Microwave Components:
Can be used for packaging high-frequency components such as microwave integrated circuits, meeting signal integrity requirements.
Industrial and Aerospace:
Suitable for high-reliability application scenarios such as industrial sensors and aerospace electronic equipment.
HTCC Process:
Relying on a mature HTCC co-firing process platform, the product offers good consistency and is suitable for scaled production.
Strict Quality Control:
Products undergo rigorous visual inspection, dimensional measurement, hermeticity testing, and reliability verification, ensuring stable and reliable quality.
Flexible Customization Solutions:
Tube shell designs can be quickly adjusted based on customer component specifications, providing full-process services from prototyping to mass production.
The working principle of the M01 ceramic package shell is to provide a mounting platform, electrical interconnection, and hermetic protection for optoelectronic and microwave components. The main body of the shell is formed by co-firing multilayer alumina ceramic at high temperatures, with tungsten metallization patterns printed between ceramic layers to achieve interlayer electrical interconnection.
Chips are fixed on the mounting surfaces within the shell cavity using conductive adhesive or eutectic soldering, and electrical connections between components and the shell metallization patterns are achieved through wire bonding. The high insulation resistance and low dielectric constant of the ceramic material ensure the electrical performance of components, while the hermetic sealing structure effectively isolates the external environment, ensuring component stability and reliability during long-term operation.
| Parameter | Specification |
|---|---|
| Material | Alumina ceramic (Al₂O₃) |
| Process | HTCC High-Temperature Co-fired Ceramic |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Microwave components, industrial and aerospace |
