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Metal 14PIN Butterfly Package Direct Insert

The metal 14-pin butterfly package with direct insertion is a professional laser diode packaging solution featuring a metal housing and a 14-pin butterfly lead configuration. It incorporates a metal housing with 14 leads and supports through-hole (DIP) mounting.

Widely used for high-performance laser diode and optoelectronic component packaging in optical communications and medical laser applications.
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Key Features

  • 14-Pin Butterfly Structure:
    Standard 14-pin butterfly package with an industry-standard pin layout, facilitating compatibility with standard packaging processes and equipment.

  • Metal Housing Hermetic Package:

    Metal housing with glass-to-metal sealing process, providing excellent hermetic performance and mechanical protection.

  • Through-Hole Mounting:
    Supports through-hole PCB mounting for easy and quick installation, suitable for integration into various electronic systems and optical modules.

Applications

  • Optical Communication Modules:

    Widely used in optical transceivers and other optical communication devices, providing reliable packaging for laser diodes.

  • Medical Laser Equipment:

    Suitable for various medical laser diagnostic and therapeutic devices requiring high precision and reliability.

  • Scientific Research Laser Systems:
    Provides flexible and high-performance laser source solutions for various laser research and development projects.

Product Highlights

  • Industry Standard Compatibility:

    The 14-pin butterfly package is a classic standard package format in the optoelectronics industry, compatible with mainstream global equipment, processes, and test systems.

  • High-Frequency High-Speed Performance:

    Optimized pin layout and package structure support high-frequency, high-speed signal transmission, suitable for high-speed optical communication applications.


How It Works

The metal 14-pin butterfly package provides a hermetic, stable operating environment for laser diodes through a metal housing and glass sealing structure.


Chip connections are established via wire bonding, connecting each electrode of the chip to the corresponding pin. An optical window allows laser output while maintaining the hermetic integrity of the package. The butterfly package profile optimizes the pin layout and signal transmission paths, reducing signal crosstalk and transmission losses.

Product Parameters

ParameterSpecification
MaterialKovar alloy, Copper-Tungsten alloy (CuW)
Structural DesignBOX cavity
Temperature ResistanceHigh thermal stability
Hermeticity≤1×10⁻⁹ Pa·m³/s
Electrical Insulation>5000 MΩ @ DC 100 V
Surface FinishNickel plating, Gold plating
DimensionsCustomizable design
PackagingStandard packaging
ApplicationsOptical communications, medical laser applications




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