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14-Pin Butterfly Structure:
Standard 14-pin butterfly package with an industry-standard pin layout, facilitating compatibility with standard packaging processes and equipment.
Metal Housing Hermetic Package:
Metal housing with glass-to-metal sealing process, providing excellent hermetic performance and mechanical protection.
Through-Hole Mounting:
Supports through-hole PCB mounting for easy and quick installation, suitable for integration into various electronic systems and optical modules.
Optical Communication Modules:
Widely used in optical transceivers and other optical communication devices, providing reliable packaging for laser diodes.
Medical Laser Equipment:
Suitable for various medical laser diagnostic and therapeutic devices requiring high precision and reliability.
Scientific Research Laser Systems:
Provides flexible and high-performance laser source solutions for various laser research and development projects.
Industry Standard Compatibility:
The 14-pin butterfly package is a classic standard package format in the optoelectronics industry, compatible with mainstream global equipment, processes, and test systems.
High-Frequency High-Speed Performance:
Optimized pin layout and package structure support high-frequency, high-speed signal transmission, suitable for high-speed optical communication applications.
The metal 14-pin butterfly package provides a hermetic, stable operating environment for laser diodes through a metal housing and glass sealing structure.
Chip connections are established via wire bonding, connecting each electrode of the chip to the corresponding pin. An optical window allows laser output while maintaining the hermetic integrity of the package. The butterfly package profile optimizes the pin layout and signal transmission paths, reducing signal crosstalk and transmission losses.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | >5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optical communications, medical laser applications |