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Excellent Thermal Stability:
Manufactured from thermally expansion-matched materials to ensure optical alignment stability and modulation performance accuracy under temperature variations.
Reliable Hermetic Sealing:
High-reliability hermetic sealing process effectively protects internal modulator chips from environmental factors.
Optical Communication Systems:
In high-speed optical communication systems, optical modulators are key components for high-speed optical signal transmission; the modulator tube shell provides reliable packaging for various modulators.
Scientific Research & Development:
In scientific research projects in photonic technology and optical communications, the modulator tube shell provides a flexible and high-performance packaging and test platform for chips.
High-Speed Modulation Support:
Shell design and manufacturing fully considers high-speed, high-frequency application requirements, supporting modulation applications at various data rates.
Long-Term Stability Assurance:
Premium materials and reliable sealing processes ensure performance stability and alignment accuracy of the modulator throughout long-term use.
Flexible Interface Configuration:
Supports various optical interface configurations (e.g., fiber arrays, waveguide coupling) and electrical interface configurations to meet different application requirements.
The modulator tube shell provides mechanical support, electrical connections, optical interfaces, and environmental protection for the optical modulator chip. For commonly used lithium niobate (LiNbO₃) optical modulators, the modulation voltage is applied to the modulator electrodes; through the electro-optic effect, it changes the refractive index of the waveguide, thereby changing the phase or intensity of the optical signal passing through to achieve optical signal modulation.
Optical signals enter the modulator through an input fiber or waveguide, and after modulation exit through an output fiber or waveguide. The tube shell must ensure precise alignment and long-term stability between the input/output fibers and the modulator waveguide. High-frequency modulation signals are input to the modulator electrodes through high-frequency pins; the pin design and internal structure of the tube shell must support high-quality transmission of high-frequency signals.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | >5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optical communication systems, scientific research & development |