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Key Features
BOX Cavity Structure：
BOX cavity design provides ample internal space for component mounting and wire bonding operations.
Hermetic Sealing：
Mates with a lid to form a sealed, stable hermetic environment that effectively isolates moisture and contaminants.
Superior Material Properties：
Manufactured from Kovar alloy, combining excellent mechanical strength with thermal stability.
Effective Thermal Dissipation：
Optimized heat-conduction paths effectively dissipate heat generated during operation, maintaining suitable working temperatures.
Customization Support：
Cavity dimensions, pin configurations, material selection, and surface finish can be customized to meet individual application requirements.
Applications
Photodetectors：
Provides a stable and reliable hermetic packaging environment for photodetectors; widely used in optical communication modules.
Laser Diodes & Fiber-Optic Components：
Suitable for hermetic packaging and protection of various laser diodes and fiber-optic assemblies.
Product Highlights
High-Reliability Hermetic Design：
Brazing sealing process ensures hermetic integrity and long-term reliability.
Superior Environmental Adaptability：
Excellent vibration and shock resistance suitable for a wide range of harsh application environments.
Flexible Customization Services：
Comprehensive custom manufacturing capabilities enabling rapid response to individual customer requirements.
How It Works
The BOX cavity package provides a closed, stable physical protection environment for optoelectronic components. The cavity base offers a component mounting interface and electrical lead-out pins; chips or TEC modules are bonded to the base mounting surface using conductive adhesive or solder, with wire bonding establishing the electrical connections between the chip and pins.
The lid is hermetically sealed to the base to form a hermetically enclosed cavity. The hermetic seal effectively prevents external moisture, dust, and other contaminants from entering the interior. For optical components, an optical window can be integrated into the cavity, allowing optical signals to pass through while maintaining hermeticity.
Product Parameters
| Parameter | Specification |
| Material | Kovar alloy, Copper-Tungsten alloy (CuW) |
| Structural Design | BOX cavity |
| Temperature Resistance | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical Insulation | ＞5000 MΩ @ DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Photodetectors, Laser diodes & fiber-optic components |
