English
Hermetic sealing structure:
Helium mass spectrometer leak rate < 1×10⁻⁹ Pa·m³/s.
High insulation performance：
> 5000 MΩ at DC 100 V.
Optical communication:
Suitable for optical communication modules and devices.
Sensing and IoT:
Used in various optoelectronic sensors and IoT devices.
Excellent hermeticity:
Leak rate < 1×10⁻⁹ Pa·m³/s, providing long-term protection for internal elements.
High insulation resistance:
Insulation resistance > 5000 MΩ at DC 100 V, with stable electrical performance.
The optoelectronic sensor chip receives optical signals through the window of the shell, converts them into electrical signals and outputs them through the pins to the external circuit. The shell is sealed with Kovar/CuW alloy and glass insulators, achieving hermetic isolation and electrical feedthrough, while the metal shell also provides mechanical support and electromagnetic shielding. Stringent hermeticity and insulation testing ensures long-term stable operation of the device in humid, corrosive and other harsh environments.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy, CuW (tungsten-copper) alloy |
| Structure | BOX cavity |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Laser projection, laser illumination |
