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Key Features
Glass-to-Metal Sealing Technology
Pins and base are sealed by glass sintering, reliable hermeticity.
Pressure Conduction Structure
The base integrates a pressure-conducting structure, convenient for pressure sensing.
Customizable Design
Structure and pin layout can be customized according to customer requirements.
Pressure Sensors
Suitable for core packaging of pressure sensor chips.
Industrial Control
Suitable for packaging sensing components in industrial pressure control systems.
Mature GTMS Process
Backed by a mature glass-to-metal sealing technology platform.
High Hermetic Reliability
Long-term protection of sensitive components operating in harsh environments.
This Pressure Sensor Header is formed by sintering 6 Kovar alloy pins and a stainless-steel base into one piece through glass-to-metal sealing technology. The glass insulators achieve electrical isolation and hermetic sealing between the pins. The pressure-sensing chip is mounted on the sensing surface of the base.
The base is designed with a pressure-conducting channel; external pressure acts on the pressure-sensitive element through this channel, causing changes in the resistance, capacitance or frequency of the sensitive element, thereby realizing the detection of the pressure signal. After the cap and the base are welded together, a hermetic cavity is formed to protect the internal sensitive components from environmental media erosion.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Pressure sensors, industrial control |
