English
| Quantity: | |
|---|---|
Key Features
Glass-to-Metal Sealing Technology
Pins and base are sealed by glass sintering, reliable hermeticity.
4-pin Pressure Sensor Layout
4-pin layout optimized for the bridge circuit of the pressure sensor.
Pressure Conduction Design
The base integrates a pressure-conducting structure, convenient for pressure sensing.
Customizable Design
Pin layout and base structure can be customized according to customer requirements.
Pressure Sensors
Suitable for packaging pressure sensor chips.
Industrial Pressure Measurement
Suitable for industrial pressure transmitters, pressure gauges and other equipment.
Automotive Pressure Sensing
Suitable for packaging automotive electronic pressure sensors.
Professional Pressure Sensor Layout
Pin layout specially optimized for pressure sensor circuits.
Mature GTMS Process
Backed by a mature glass-to-metal sealing technology platform.
Fast Response to Customization
Can quickly respond to customers' customized structural requirements.
The 4-pin Pressure Sensor Header is formed by sintering 4 pins and a metal base into one piece through glass-to-metal sealing technology. The glass insulators achieve electrical isolation and hermetic sealing between the pins. The pressure-sensing chip is mounted on the pressure-sensing surface of the base.
After the cap and the base are welded together, a hermetic cavity is formed to protect the internal chip from environmental media erosion.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Pressure sensors, industrial pressure measurement, automotive pressure sensing |
