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Views: 0 Author: Site Editor Publish Time: 2026-02-24 Origin: Site
From January 20 to 22, 2026, the globally renowned photonics event, Photonics West 2026, was successfully held at the Moscone Center in San Francisco, California, USA. Rizhao Xuri Electronics made a significant appearance at this exhibition, engaging in in-depth exchanges with global industry leaders and professional partners. The company keenly identified the core trend in photonic packaging technology evolving towards an integrated "Material-Structure-Thermal Management" system solution.
The exhibition revealed that high-frequency transmission, efficient heat dissipation, high-density integration, and lightweight design have become common technical challenges in cutting-edge fields such as optical communications and LiDAR. The market demand for systematic, high-reliability packaging solutions is becoming increasingly urgent.
During the event, the company prominently showcased its high-frequency HTCC ceramic packaging for next-generation optical modules, lightweight aluminum alloy hermetic packaging solutions for automotive LiDAR, and a series of advanced thermal management products. These offerings attracted extensive attention and led to in-depth discussions with numerous industry experts and potential clients.
Building on the insights gained from this exhibition, Rizhao Xuri Electronics will continue to deepen its technological focus in the areas of high-frequency ceramics and lightweight packaging, striving to become a world-leading service provider in the field of electronic hermetic packaging.
