SLED/DFB/DWDM/SOA Butterfly Fiber Coupled Laser Diode 14pin header

Key Features

• Multi-Laser Compatible Design

  Compatible with SLED, DFB, DWDM, SOA and other laser chips for packaging.

• 14-pin High-Density Layout

  14 pins support multi-channel signals and temperature-control circuit integration.

• Customizable Design

  Customizable according to the customer's chip type, pin layout and fiber interface.

Applications

• Optical Communication Systems

  Suitable for packaging DFB, DWDM and other optical communication lasers.

• Fiber-Optic Sensing

  Can be used for packaging SLED and other broadband light sources in fiber-optic sensing systems.

• Optical Test & Measurement

  Suitable for packaging SOA, SLED and other devices in optical test equipment.

Product Highlights

• Multi-Chip Compatibility

  A single header can be applied to multiple laser chips, improving product versatility.

• Mature CTMS Process

  Backed by a mature ceramic-to-metal sealing technology platform, products have good consistency.

• Fiber-Coupling Customization

  Supports single-mode/multi-mode fiber coupling solutions for flexible adaptation.

How It Works

The SLED/DFB/DWDM/SOA Butterfly Fiber-Coupled Laser Diode 14-pin Header works by providing a mounting platform, electrical interconnection, fiber coupling and hermetic protection environment for various laser chips. The base is made of Kovar alloy; the chip-mounting area is located at the center of the base; the SLED, DFB, DWDM or SOA chips are fixed on the metallized mounting surface.

The header integrates a fiber-coupling alignment structure inside; the light emitted by the laser chip is coupled into single-mode or multi-mode fibers through an internal lens and then output via the pigtail interface of the tube shell. The cover and the tube shell are welded together to form a hermetic cavity.

Product Parameters