Semiconductors Laser Diode Modules- shell-XR-high power

Key Features

• Premium Material Construction:
  Manufactured from high-quality CuW and Kovar alloy, featuring high thermal conductivity, a CTE matched to the chip, and excellent mechanical strength.

• Reliable Hermetic Sealing:
  

  Reliable parallel seam welding or AuSn eutectic solder sealing process achieves high hermeticity standards.

• Customization Services:
  Supports customized design based on customer-specific requirements, including dimensions, pin configuration, material selection, and surface finish.

Applications

• Medical Laser Systems:
  

  Suitable for various medical laser therapy devices requiring high reliability and long-term stable operation.

• Scientific Research & Defense:
  

  Plays an important role in scientific research and defense applications such as LiDAR systems.

Product Highlights

• Superior Overall Performance:
  

  Excellent comprehensive performance in thermal management, electrical performance, hermeticity, and mechanical strength to meet high-reliability application requirements.

How It Works

The semiconductor laser diode module shell provides mechanical support, thermal conduction paths, electrical connection interfaces, and environmental protection for the laser module. The laser diode chip inside the module is bonded to the high-thermal-conductivity heat-dissipation surface of the housing base using thermally conductive material, ensuring effective heat transfer during operation.

Electrical connections are established via wire bonding, connecting the chip electrodes to the housing pins. The hermetic package structure is achieved through AuSn solder sealing, protecting sensitive internal components from environmental influences. The housing design comprehensively considers thermal management, electrical performance, mechanical protection, and hermeticity to ensure long-term stable operation of the laser diode module.

Product Parameters