English
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Glass-to-metal sealing process:
The pins and base are sealed by glass sintering for reliable hermeticity.
Standard 3-pin structure：
Standard TO18 three-pin layout with strong compatibility.
High reliability:
Verified through reliability tests such as temperature cycling and mechanical shock.
Optical communication:
Used for laser and detector TO18 packaging.
Sensors:
Suitable for packaging various sensor devices.
Mature process platform:
Mature GTMS process with excellent product consistency.
Excellent hermeticity:
Long-term protection of internal elements against environmental influence.
The TO18 3-pin header provides mechanical support, electrical interconnection and hermetic protection for the chip. The chip is die-attached to the mounting surface of the base and connected to the pins by wire bonding; the glass insulator is sintered between the pins and the base, providing electrical isolation and a hermetic seal. When the cap is welded to the base, a complete hermetic cavity is formed to protect the internal chip. The pins pass through the glass insulator to lead electrical signals out to the external circuit.
| Parameter | Specification |
|---|---|
| Material | SPCC |
| Structure | TO header |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optical communication, sensors |
