English
| Quantity: | |
|---|---|
4-pin extended design:
Four pins provide more electrical connection channels.
Compatible with standard TO18 dimensions：
Fully compatible with the standard TO18 package system.
GTMS hermetic packaging:
Glass-to-metal sealing process with reliable hermeticity.
High reliability:
Robust structure adaptable to various application environments.
Optical communication:
Used for laser chip packaging.
Sensors:
Used for multi-pin sensor packaging.
Flexible pin expansion:
Four pins accommodate diverse circuit requirements.
Stable hermetic performance:
Long-term protection of element performance.
The TO18 4-pin header sinters the four pins and the metal base into one unit through glass-to-metal sealing. The glass insulator provides electrical isolation and hermetic sealing between the pins. The chip is mounted on the base and connected to the pins by bonding wires, and the multi-pin structure supports multi-channel signal transmission for the device. The hermetic cavity protects the chip from environmental influence.
| Parameter | Specification |
|---|---|
| Material | SPCC |
| Structure | TO header |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optical communication, sensors |
