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Key Features
TO18 Standard Structure
Compatible with the TO18 standard header dimensions, convenient for mounting and sealing.
Compact Structural Design
Small in size and light in weight, suitable for miniaturized device packaging.
High Sealing Reliability
After welding with the header, a complete hermetic cavity is formed, protecting the internal chip for a long time.
Customizable Design
Dimensions and surface treatment can be customized according to customer requirements.
Diodes, Transistors
Suitable for packaging TO18 laser diodes, transistors and other small optoelectronic devices.
Compatible with Standard TO18
Conforms to the TO18 standard dimensions, with strong compatibility.
Flexible Customization
Dimensions and surface treatment can be adjusted according to customer requirements.
The TO18 Cap works by matching with the TO18 standard header to form a complete hermetic package. The cap has an annular sealing surface at the bottom, which mates with the sealing surface of the TO18 header, and is sealed by welding to form a complete hermetic cavity.
The TO18 cap is small in size and mainly used for packaging small optoelectronic devices. The chip is connected to the pins by wire bonding. After the cap is welded and sealed, a hermetic cavity is formed to protect the internal chip from environmental influences and ensure the stability of the device during long-term operation.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Applications --Diodes, Transistors |
