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Excellent electrical insulation:
The glass insulator isolates the pins from the base.
Multi-field applicability：
Compatible with optoelectronic devices, sensors and other elements.
Optical communication:
Used for packaging optoelectronic elements.
Sensors:
Suitable for various sensor packages.
Automotive electronics:
Used for automotive-grade electronic component packaging.
Mature process:
Built on a mature GTMS process platform.
Consistent quality:
Full-process inspection ensures excellent consistency.
Customization supported:
Customized to drawings to meet diverse requirements.
The TO33 header achieves electrical isolation and hermetic connection between the pins and the base through glass-to-metal sealing. Elements are mounted on the base mounting surface and interconnected with the pins by wire bonding. The glass insulator forms a dense seal with the metal after high-temperature sintering, preventing gas and moisture permeation and protecting the internal elements. Electrical signals are transmitted through the pins to the external circuit, meeting the requirements for long-term stable device operation.
| Parameter | Specification |
|---|---|
| Material | SPCC, CuW (tungsten-copper) alloy |
| Structure | TO header |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optoelectronic devices, sensors, automotive electronics |
