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Key Features
Glass-to-Metal Sealing Technology
Pins and base are sealed by glass sintering, reliable hermeticity.
8-pin Extended Design
8 pins provide more electrical connection channels, suitable for multi-channel devices.
Nail-Head Mounting Structure
Integrated nail-head structure, convenient for PCB welding positioning and assembly.
High Reliability
Passed temperature cycling, mechanical shock and other reliability verifications.
Mature Process Platform
Mature GTMS process with good product consistency.
Excellent Hermeticity
Long-term protection of internal components from environmental influences.
Flexible Structure & Cost
The nail-head design facilitates PCB mounting and positioning. Compared with stainless steel, it offers larger headroom and lower cost.
The TO39-8pin with Nail-Head Header is formed by sintering 8 Kovar alloy pins and a metal base into one piece through glass-to-metal sealing technology. The glass insulators achieve electrical isolation and hermetic sealing between the pins. The chip is mounted on the mounting surface at the center of the base and connected to the pins by wire bonding; the multi-pin structure supports multi-channel signal transmission of the device.
The nail-head structure is located at the end of the pins, convenient for customer welding positioning and mechanical fixing. After the cap and the base are welded together, a complete hermetic cavity is formed to protect the internal chip from environmental influences.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar) |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Standard packaging Applications --Pressure sensors |
