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Key Features
TO39 Standard Structure
Compatible with the TO39 standard header dimensions, convenient for mounting and sealing.
High Sealing Reliability
After welding with the header, a complete hermetic cavity is formed, protecting the internal chip for a long time.
Customizable Design
Dimensions and materials can be customized according to customer requirements.
The TO39 Cap works by matching with the TO39 standard header to form a complete hermetic package. The cap has an annular sealing surface at the bottom, which mates with the sealing surface of the TO39 header, and is sealed by welding with the header to form a complete hermetic cavity.
The chip is mounted on the mounting surface of the header. After the cap is welded and sealed, the internal chip is protected from moisture, dust and other contaminants, ensuring the stability of the device during long-term operation.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging / Bag packaging |
| Applications | Transistors, SAW resonators |
