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Key Features
Glass-to-Metal Sealing Technology
Pins and base are sealed by glass sintering, reliable hermeticity.
TO39 Standard Packaging Structure
Conforms to the industry TO39 standard dimensions, with strong compatibility.
Highly Reliable Hermetic Packaging
Hermeticity meets high-reliability standards, providing long-term protection of internal components.
Optoelectronic Diodes
Used for TO39 packaging of various optoelectronic diodes and lasers.
Infrared Detectors
Suitable for packaging infrared detectors and pyroelectric detectors.
Classic TO39 Structure
TO39 is one of the most classic packaging structures in the industry, with a wide range of applications.
Mature Process Platform
Mature GTMS process with good product consistency.
Flexible Customization
The number and layout of pins can be flexibly adjusted.
The TO39 Standard Header is formed by sintering Kovar alloy pins and a metal base into one piece through glass-to-metal sealing technology. The glass insulators achieve electrical isolation and hermetic sealing between the pins and the base. The chip is connected to the pins by wire bonding, leading the electrical signals out to the external circuit.
The cap and the base are welded together to form a complete hermetic cavity. The TO39 packaging structure has a long history of industrial application, with stable and reliable packaging performance, suitable for various optoelectronic and sensing components.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Optoelectronic diodes, infrared detectors |
