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Key Features
Glass-to-Metal Sealing Technology
Pins and base are sealed by glass sintering, reliable hermeticity.
(2+1) Pin Compact Layout
The (2+1) pin layout is compact, suitable for miniaturized device packaging.
TO5 Standard Structure
Conforms to the TO5 standard dimensions, with strong compatibility.
Customizable Design
Pin layout and base structure can be customized according to customer requirements.
Photodetectors
Suitable for packaging small detectors such as photodiodes.
Laser Diodes
Suitable for TO5 packaging of low-power laser diodes.
Compact Structural Design
(2+1) pin compact design, small in size.
Mature GTMS Process
Backed by a mature glass-to-metal sealing technology platform.
Flexible Customization
Pin layout can be flexibly customized.
The TO5 (2+1) Header is formed by sintering (2+1) pins and a metal base into one piece through glass-to-metal sealing technology. The glass insulators achieve electrical isolation and hermetic sealing between the pins. The chip is mounted on the mounting surface of the base and connected to the corresponding pins by wire bonding.
In the (2+1) pin layout, 2 pins are used for signal transmission and 1 pin is used for grounding or shielding. After the cap and the base are welded together, a complete hermetic cavity is formed to protect the internal chip from environmental influences and ensure the stability of the device during long-term operation.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Photodetectors, laser diodes |
