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Key Features
Glass-to-Metal Sealing Technology
Pins and base are sealed by glass sintering, reliable hermeticity.
(3+1) Pin Layout
The (3+1) pin layout adapts to signal and functional grounding requirements.
TO5 Standard Structure
Conforms to the TO5 standard dimensions, with strong compatibility.
High Reliability
Passed temperature cycling, mechanical shock and other reliability verifications.
Photodetectors
Suitable for packaging photodiodes and other detectors.
Laser Diodes
Suitable for TO5 packaging of various laser diodes.
Flexible (3+1) Pin Layout
The (3+1) pin layout is flexible to adapt to various circuit requirements.
Mature GTMS Process
Backed by a mature glass-to-metal sealing technology platform.
Strict Quality Control
Subjected to rigorous appearance, dimensional and reliability tests.
The TO5 (3+1) Header is formed by sintering (3+1) Kovar alloy pins and a metal base into one piece through glass-to-metal sealing technology. The glass insulators achieve electrical isolation and hermetic sealing between the pins. The chip is mounted on the mounting surface of the base and connected to the corresponding pins by wire bonding.
In the (3+1) pin layout, 3 pins are used for signal transmission and 1 pin is used for dedicated functions such as grounding or shielding. After the cap and the base are welded together, a complete hermetic cavity is formed to protect the internal chip from environmental influences and ensure the stability of the device during long-term operation.
| Parameter | Specification |
|---|---|
| Material | Kovar alloy (Kovar), SPCC |
| Process | GTMS |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel plating, Gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | Photodetectors, laser diodes |
