The Future of Hermetic Packaging — New Materials, New Processes and New Trends

1. New Material Directions

Hermetic packaging materials keep evolving; three major directions deserve attention:

Low-temperature sealing glass — traditional borosilicate glass must be sealed at temperatures above 900°C, while new low-temperature glasses bring the sealing temperature down below 600°C. This reduces thermal stress and cracking risk while saving energy. More importantly, low-temperature sealing allows thinner, more precise metal housings.

Aluminum nitride ceramic (AlN) — thermal conductivity 7~8 times that of Al₂O₃. As laser power density keeps climbing, AlN is becoming the ceramic of choice for high-power CTMS packages.

Active brazing fillers — fillers containing Ti and Zr react directly with the ceramic, eliminating the prior metallization step. This simplifies the CTMS process flow, shortens production cycles and cuts costs, and such fillers are already being adopted in small-batch, high-performance products.

2. Industry Trends: Summary and Outlook

From “why hermetic packaging is needed” to “how to test, how to prevent defects and how to apply it”, this series has traced the complete technical landscape of hermetic packaging. Looking ahead, three major trends will drive the industry:

5G/6G high-frequency development drives growing CTMS demand — at millimeter-wave frequencies the dielectric loss of glass rises sharply, making ceramic packaging a hard requirement. The HTCC ceramic substrates that Xuri has positioned are precisely the product line reserved in advance for this trend.

New-energy-vehicle sensors are scaling up — the high-temperature, high-humidity, high-salt-fog automotive environment imposes new demands of “low cost + high volume + high reliability” on hermetic packaging, forcing continuous optimization of GTMS processes.

The hermetic packaging industry is moving from “being able to seal” to “sealing well, sealing fast and sealing economically” — where technological progress meets industrial upgrading.

[Series Conclusion] From the basic principles of hermetic packaging, the two major processes (GTMS/CTMS), surface treatment, quality testing and defect prevention, to the manufacturing flow, industry applications and future trends, this series has systematically covered the full knowledge chain of hermetic packaging.

[Glossary]

1. Low-Temperature Sealing Glass: a new glass material with a sealing temperature below 600°C, reducing thermal stress and energy consumption

2. Active Brazing Filler: a brazing filler containing active elements such as Ti/Zr that reacts and bonds directly with the ceramic, eliminating the prior metallization step