English
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25G high-speed transmission:
Optimized for 25 Gbps signals with excellent high-frequency characteristics.
Hermetic metal packaging：
Hermetic packaging based on the GTMS process with high reliability.
25G optical modules:
Used in the transmitter end of 25G optical transceiver modules.
Data centers:
Suitable for high-speed interconnects in data centers.
Optimized high-frequency performance:
Designed and optimized for 25 Gbps high-speed signal transmission.
The 25G laser header carries the high-speed laser chip, which is solder-mounted on the base to achieve low thermal resistance and a reliable mechanical connection. The chip electrodes are connected to the five pins by gold wire bonding; the pins provide high-frequency drive signal feedthrough and monitor photodiode signal output. The glass insulators ensure hermeticity and insulation between the pins and the base, and the metal header structure provides high-frequency grounding and electromagnetic shielding, ensuring the integrity of 25 Gbps signal transmission.
| Parameter | Specification |
|---|---|
| Material | SPCC, CuW (tungsten-copper) alloy |
| Structure | TO header |
| Temperature rating | High thermal stability |
| Hermeticity | ≤1×10⁻⁹ Pa·m³/s |
| Electrical insulation | ＞5000 MΩ at DC 100 V |
| Surface Finish | Nickel/gold plating |
| Dimensions | Customizable design |
| Packaging | Standard packaging |
| Applications | 25G optical modules, data centers |
